Soft Lithography
Anatech SCE 108 Barrel Asher
TOOL ID: DE-02
Anatech USA’s SCE-100 Series Inductively Coupled (ICP) Plasma systems are extremely effective for a Plasma Ashing process to activate a surface prior to bonding PDMS, e.g.
Process gases is O2. Sample sizes are pieces to 100mm round wafers.
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ABM 3000HR Mask Aligner
TOOL ID: MA-03
The 3000HR series Mask Aligner is high resolution, Contact/Proximity Aligner. The system offers precise and repeatable sub-micron alignment and exposure for many wafer and substrate sizes. This includes sensitive, brittle and odd shaped materials. The precision wedge-error compensation vacuum chucks offer consistent mask to substrate planarization for accurate separation adjustment and ease of alignment.
Specifications:
- 350 Watt UV Exposure System with Intensity Controlling Power Supply
- 365 nm Output Intensity – Approximately 20-25 mW/cm²
- 400 nm Output Intensity – Approximately 40-50 mW/cm²
- Uniform/Collimated Beam Size: 5.0″ Diameter
- Beam Uniformity: ± 3-5%
- Adjustable Expose Timer: Adjustable from .1 to 999.9 Seconds
- Nikon Single Field Binocular Microscope with 5x, 10x, & 20x Objectives, 10x Eyepieces, including Adjustable Coaxial Illuminator.
- Stationary Mask Alignment Module with X,Y,Z, and Theta Motion
- Electronic/Pneumatic Operator Control Panel
- Top Load Vacuum Holders for 4” x 4 and ”5” x 5” Masks
- Planarizing Vacuum Chuck for Piece Parts (up to 1” Diameter) & 4” Wafers
- Z axis Adjustment: ±750 µm
- Mask-to-Substrate Separation: settable in 10 µm increments
- Front-side Alignment Accuracy: < 0.5 µ
Printing Resolution: Near UV < 0.8µm
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Spinner and Solvent Processing Benches
SU-8/PDMS Resist Spinner
TOOL ID: SPN-07
- Maximum speed of 10,000 rpm
- User friendly programmable interface
- Programmable step functions (up to 10 steps per recipe)
- Programmable process control
- Wafer sizes from pieces through 150mm
Vacuum Oven
Vacuum oven capable of reaching ~10 Torr with digital gravity convection for curing samples from 25-250C
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