Equipment/Instrumentation

AMB 3000

 

AMB 3000HR Mask Aligner

The 3000HR series Mask Aligner is high resolution, Contact/Proximity Aligner. The system offers precise and repeatable sub-micron alignment and exposure for many wafer and substrate sizes. This includes sensitive, brittle and odd shaped materials. The precision wedge-error compensation vacuum chucks offer consistent mask to substrate planarization for accurate separation adjustment and ease of alignment.

Specifications:

  • 350 Watt UV Exposure System with Intensity Controlling Power Supply
  • 365 nm Output Intensity – Approximately 20-25 mW/cm²
  • 400 nm Output Intensity – Approximately 40-50 mW/cm²
  • Uniform/Collimated Beam Size: 5.0″ Diameter
  • Beam Uniformity: ± 3-5%
  • Adjustable Expose Timer: Adjustable from .1 to 999.9 Seconds
  • Nikon Single Field Binocular Microscope with 5x, 10x, & 20x Objectives, 10x Eyepieces, including Adjustable Coaxial Illuminator.
  • Stationary Mask Alignment Module with X,Y,Z, and Theta Motion
  • Electronic/Pneumatic Operator Control Panel
  • Top Load Vacuum Holders for 4” x 4 and ”5” x 5” Masks
  • Planarizing Vacuum Chuck for Piece Parts (up to 1” Diameter) & 4” Wafers
  • Z axis Adjustment: ±750 µm
  • Mask-to-Substrate Separation: settable in 10 µm increments
  • Front-side Alignment Accuracy: < 0.5 µ

Printing Resolution: Near UV < 0.8µm

AMB 3000