Oxford Plasma Lab 80+ RIE

Oxford Instruments Plasma Lab 80+ RIE


A compact open-loading tool for Reactive Ion Etching – Oxford 80+ RIE

The Oxford 80+ offers versatile reactive ion etch solutions on one platform with convenient open loading. This compact, small footprint system is easy to use, with no compromise on process quality.

It is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 200mm wafers. The open load design allows fast wafer loading and unloading, ideal for research, prototyping and low-volume production.

  • 600W RF generator
  • Up to 200mm wafers
  • Process gases: CF4, Ar, O2, SF6 and CHF3
  • Excellent etch control
  • Excellent process control
  • Documented baseline recipes are provided by Penn’s QNF staff


Oxford Plasma Lab 80+ RIE