Equipment/Instrumentation

Lesker PVD 75 3

Lesker PVD 75 3

  • Load locked system
  • Three DC guns
  • Able to co-sputter two DC sources
  • One RF gun
  • Cryo pumped with automated interface
  • Automated control of film thickness
  • Pieces through 150mm wafers
  • Wafer platen rotation with heating
Lesker PVD 75 3