Equipment/Instrumentation

EVG 510 Wafer Bonder

EVG 510 Wafer Bonder

The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five

minutes, making it ideal for universities and R&D as well as small-volume production applications.

Features

  • R&D and pilot line production
  • Bonds up to 10 kN force at temperatures up to 450°C
  • Real and low-force wafer wedge compensation system for highest yield
  • Large process window: temperature uniformity <+/- 1% and pressure uniformity

<+/- 5%

EVG 510 Wafer Bonder