SPTS Deep Silicon Etch



With an installed base of over 1000 DRIE process modules, SPTS’ market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

Advantages of SPTS Si DRIE

  • Patented dual plasma source design with independently controlled primary and secondary decoupled plasma zones, with independent dual gas inlets. This results in a highly concentrated and uniformed distribution of radicals.
    • High etch rate
    • Excellent uniformity
    • Controls tilting of deep features across the wafer
  • Inherent multi-mode flexibility also allows complementary oxide etching within the same hardware.

Delivering unparalleled process capability with world-class productivity & cost of ownership benefits, SPTS’ DRIE process modules are used in a wide variety of applications across multiple end markets.

All processes at QNF are developed collaboratively with Nanofab staff, SPTS Applications and the PI group.

SPTS Deep Silicon Etch