SPTS Deep Silicon Etch
SPTS Rapier Si DRIE
With an installed base of over 1000 DRIE process modules, SPTS’ market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.
Advantages of SPTS Si DRIE
- Patented dual plasma source design with independently controlled primary and secondary decoupled plasma zones, with independent dual gas inlets. This results in a highly concentrated and uniformed distribution of radicals.
- High etch rate
- Excellent uniformity
- Controls tilting of deep features across the wafer
- Inherent multi-mode flexibility also allows complementary oxide etching within the same hardware.
Delivering unparalleled process capability with world-class productivity & cost of ownership benefits, SPTS’ DRIE process modules are used in a wide variety of applications across multiple end markets.
All processes at QNF are developed collaboratively with Nanofab staff, SPTS Applications and the PI group.