Suss MicroTec AltaSpray Automated Spray Coated AS8
Automated Spray Coater for High Topographies
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging.
Wafer sizes from pieces to 200mm. Common resists sprayed are SU-8, S1800 and various AZ formulations.