EVG 620 Wafer Bond Aligner
EVG 620 Wafer Bond Aligner
TOOL ID: BE-02
Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Features
- Supports bond alignment of double or triple wafer stacks up to 150 mm wafer sizes
- Manual or motorized alignment stage
- Fully motorized high resolution bottom side microscopes
- Windows® based user interface
- Quick tool change between different wafer sizes and different bonding applications
EVG 620 Wafer Bond Aligner
